Gold bonding wire for semiconductor applications
نویسندگان
چکیده
منابع مشابه
Digital Control of Bonding Force for Gold Wire Bonding Machine
In order to digitally control the bonding force of a wire bonder precisely, this paper uses a DC solenoid as a force source, and by controlling the solenoid’s current, which causes the electromagnetic force, we can control the bonding force that capillary applies. The bonding force control system in this paper is composed of PC (Personal Computer) and hypogyny MCU (Micro Controller Unit), which...
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متن کاملRecrystallization and Grain Growth of Gold bonding Wire
Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The textures of the drawn gold wires contain major <111>, minor <100> and small fractions of complex fiber components. The <100> oriented regions are located in the center and surface of the wire, and the complex fiber component regions are located near the surface. The ...
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INTRODUCTION The expression „multifunctional PCB“, as a synonym for a PCB which is applicable with a variety of assembly techniques, is already established on the market. That means the PCB can be used for multiple reflow soldering and multiple assembly techniques like, Al-wire bonding, Auwire bonding, conductive adhesives and other interconnection methods. In the mixed COB/SMT assembly, where ...
متن کاملRecrystallization and Grain Growth of Cold drawn Gold bonding Wire
Recrystallization and grain growth of gold bonding wire have been investigated with Electron Back Scatter Diffraction (EBSD). The bonding wires were wire-drawn to an equivalent strain greater than 11.4 with final diameter between 25 and 30μm. Annealing treatments were carried out in a salt bath at 300°C, 400°C for 1 min, 10 min, 60 min, and 1 day. The textures of the drawn gold wires contain ma...
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ژورنال
عنوان ژورنال: Gold Bulletin
سال: 1982
ISSN: 0017-1557,2190-7579
DOI: 10.1007/bf03214605